Used VARIAN 3290 #9375148 for sale

VARIAN 3290
Manufacturer
VARIAN
Model
3290
ID: 9375148
Sputtering system ECS Control RF Etcher with (3) deposition stations CTI-CRYOGENICS On-Board 8 Cryo-pump AGILENT Turbo pump VIPS With low voltage RF ignition Gen 2.5 Air cooled power supplies.
VARIAN 3290 is a sputtering equipment designed for a variety of deposition applications. It utilizes features such as a combination of RF and DC sputter power sources to enable highly conformal and uniform thin-film coatings on substrates. The system also features both planar and rotatable sputter targets, enabling the deposition of one or more material layers on substrates in high proportions. 3290 is equipped with high vacuum pumping and gas abatement systems that enable high-speed growth and deposition processes. Additionally, the unit has a compact design that allows for small footprint operation in a user-friendly and ergonomic workplace. VARIAN 3290 features a computer-controlled frequency-based sputter power control machine that enables the maximum deposition rate for any process. The tool also contains an adjustable turbo sputtering asset that can be used for both RF and DC sputter deposition. The model is equipped with an electro magnetic sputter shutter control feature that allows the user to accurately control sputter power and deposition rate. Additionally, the equipment has an intuitive digital inert gas injection system, which enables precise control of the deposition process. 3290 also utilizes an advanced sputter gas unit that enables precise control of the sputter flow and substrate temperature. The machine includes a closed loop temperature control tool that enables precise temperature control of the substrate surface. Additionally, the asset contains a dynamic pressure control feature that can be adjusted to provide the correct pressure controls for the desired coating rate. VARIAN 3290 provides the highest sputter concentrations per unit area than any other comparable systems. 3290 is one of the most advanced sputtering systems available and can be used for highly conformal and uniform thin-film deposition processes. The model utilizes a wide range of sputter power supplies to control various parameters, such as substrate temperature and surface pressure. Additionally, the equipment features an adjustable turbo sputter system and a frequency-based sputter power control unit as well as an intuitive inert gas injection machine. The tool also contains a dynamic pressure control feature to ensure the desired coating rates are achieved.
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