Used VARIAN E17045261 #9126495 for sale

VARIAN E17045261
Manufacturer
VARIAN
Model
E17045261
ID: 9126495
Ring, chuck.
VARIAN E17045261 is a high-performance sputtering equipment ideal for thin film deposition applications. This system is a cathode-assisted sputtering technology that offers advanced film uniformity, low energy consumption, and improved operational longevity for maximum performance. E17045261 is a single-source, dual-magnetron sputtering unit that utilizes a highly efficient, low-power source to effectively deposit films on substrates. This machine is equipped with an advanced multi-pocket source assembly, allowing for simultaneous deposition of material from multiple sources into the deposition chamber. The use of multiple sources eliminates contamination from one source to the other, thus controlling the deposition thickness of the film on the substrate. The multi-pocket source also provides a high degree of process uniformity across the substrate. This tool is designed to optimise production yields through the advanced control of source/catode ICs and temperature control, helping to ensure the accuracy of the film properties, as well as reduce downtime or operational costs. By controlling source power, current, voltage, and temperature, VARIAN E17045261 efficiently deposits films with perfect film uniformity and excellent step coverage, resulting in superior mechanical and electrical properties. The asset also includes a sputter-assist chamber, which allows for more control over the growth of silicon-based films. This sputter-assist chamber feature helps in controlling the oxidation of the growingSi films, allowing for more efficient use of materials. In addition, the sputter-assist chamber reduces the need for excess SiSiO2 precursors, resulting in highly reproducible growth rates throughout the deposition process. E17045261 is an excellent choice for thin film deposition applications, as it combines advanced process control and efficient substrate coverage with low operational costs. This model also provides significant advantages in terms of material savings and process uniformity, providing effective deposition of even complex features with quicker deposition cycles, leading to increased throughput and reduced costs. The increased control confidence of this equipment ensures that films can be deposited with near-perfect accuracy and excellent mechanical and electrical properties.
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