Used VARIAN E40000991 #9126497 for sale

VARIAN E40000991 sputtering equipment is a highly advanced, precise sputtering system designed to produce high-performance thin films with superior adhesion and precise layer thickness. It combines a precise, low-pressure cathode arc source with advanced DC and pulse-power control features to allow it to create target materials with high quality deposition performance over a wide temperature range. This makes it ideal for applications that require a precise, precise thin-film layer production. E40000991 sputtering unit consists of a source chamber, a target material source, a vacuum chamber, and various machine control hardware. The source chamber consists of a cathode arc source, which utilizes energy-efficient arc discharge to create a high-voltage arc in a vacuum chamber. The arc can provide a high temperature, low-pressure environment capable of creating thin-film deposition. The vacuum chamber houses the cathode arc source and target material source, allowing for precise thickness control as well as absolute deposition control. The power supply in VARIAN E40000991 tool is capable of delivering DC or pulsed power up to 2000 W. This feature allows it to effectively coat a variety of materials such as wafers, SiO2 and other oxides, without forming a significant heat sink that would simplify the deposition process. Furthermore, it can be used with a variety of target materials, such as multi-layer thin films, that cannot be deposited with traditional sputtering systems. In addition, the sputter asset includes a sophisticated control model for ensuring precise deposition control and regulating the process temperature. This control equipment utilizes powerful adaptive auto-tuning algorithms to maintain optimum thin-film deposition by compensating for changes in the vacuum chamber temperature and pressure. Additionally, advanced monitoring of the deposited film thickness and error correction are included as part of the system. Overall, E40000991 sputtering unit is an advanced, precise sputtering machine designed to provide high-quality thin film materials in a wide range of temperature and pressure ranges. Its intelligent control tool allows for precise deposition control, a variety of target materials, and a reduction in the time needed for thin-film production. This makes it an ideal choice for applications requiring the utmost in precision.