Used VARIAN / TEL / TOKYO ELECTRON MB2-730 #124470 for sale
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ID: 124470
Wafer Size: 8"
Vintage: 1998
CVD system, 8"
System Configuration
Process: W-Si
(Qty 3) Chambers
Main Body
Additional Breaker Box
Process Kit
Footplate
Accessory Box
Mainframe Indexer
(Qty 2) Controller PC
Cable
Chiller
UPS
Power rack
Power distribution
Cable Cabinet
Chiller Hose
Missing Part: Motor Server Driver
Voltage: 208+/-10 VAC60HZ
Max Power: 70KVA
Water Pressure: 5kgf/cm2 (Max)
Water Flow: 0 L/min
Water Temp: 15~25℃
General EXH VOL: 3.8m3/min
Air≧6.0 kgf/cm2, 320 L/min
Earth Class 3 GND (ISOEATED)
Weight: 2800kg
Room Temp.: 20~25℃
Humidity: 40~50%
Gas configuration
2 (Oxidation): 1.5+/-0.3 kgf/cm2, 6L/min
N2 (Reduction Gas): 2.5+/-0.3 kgf/cm2, 125L/min
Ar: 1.5+/-0.3 kgf/cm2, 1500SCCM
WF6: -200+/-50mmHg, 1500SCCM
CIF3: -200+/-50mmHg, 1500SCCM
DCS: -200+/-50mmHg, 1500SCCM
1998 vintage.
VARIAN / TEL / TOKYO ELECTRON MB2-730 sputtering equipment is a versatile thin-film deposition tool used for the formation of thin films with complex chemical compositions for a variety of applications. TEL MB2-730 utilizes magnetron sputtering, which uses a magnetically-confined plasma to sputter-deposit material onto a substrate. This sputtering process is highly controllable, allowing the system to create thin-film deposition with precise composition control, from simple to complex materials. By controlling the amount and type of targets in each chamber, a wide range of materials can be sputter-deposited. VARIAN MB2-730 is comprised of two 1,000 mm x 900 mm chambers. The first chamber, the sputter chamber, uses direct-current (DC) magnetron sputtering using three cylindrical magnetron targets. The second chamber, the IOX/CVD chamber, uses radio frequency (RF) magnetron sputtering to deposit oxide and nitride films, and also has four targets for chemical vapor deposition (CVD). In addition, this unit has a removable heating/cooling plate, allowing for temperature control of the substrate during deposition. This plate also allows for further control over the depositions, enabling the machine to perform in-situ thermal treatments and rapid annealing. MB2-730 tool also has a fully automated asset that controls the deposition process. TOKYO ELECTRON MB2-730 features a programmable process controller (PPC) with 20 available recipes, allowing for accurate, repeatable results. Additionally, the model is equipped with a PC-based graphical user interface (GUI), which allows for easy and intuitive control of deposition parameters. In conclusion, VARIAN / TEL / TOKYO ELECTRON MB2-730 sputtering equipment is an excellent tool for creating thin films with complex chemical compositions. Its versatile deposition process, temperature control capabilities and automated control system make it perfect for a variety of thin-film deposition applications.
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