Used VARIAN / TEL / TOKYO ELECTRON MB2-830 #293595641 for sale

VARIAN / TEL / TOKYO ELECTRON MB2-830 is a high-performance sputtering equipment designed for use in advanced thin film device research and processing. The system features a direct-cathode sputtering configuration for efficient production of thin film layers and a wide range of material compatibility. TEL MB2-830 features a low magnetic field target configuration and an advanced planar magnetron sputtering process. This unit can be used to create thin film layers on various substrates, and its efficient sputtering process allows for high-quality film deposition and homogeneity. The machine is equipped with a powerful and versatile ion source, along with sophisticated ion beam monitoring and metrology control capabilities. The variable-frequency power supply can be tailored to the desired target material and coating requirements, giving users the necessary flexibility when depositing thin films. VARIAN MB2-830 also has an advanced cooling solution that ensures stable temperature operation and excellent film uniformity and adhesion. Its DC-based sputter process eliminates ion "dip" erosion that may cause thin film defects. The tool is compatible with a wide range of substrate types, from silicon to glass, and can be used to produce nanometer-level film deposition. MB2-830 includes a high-performance, RF-driven control asset. This ensures stability in thin film deposition, with improved process control and excellent model throughput. The equipment also features an integrated heating unit that is used to generate the necessary substrate temperature for high-quality thin film deposition. The system includes a color LCD monitor for convenient user interface and operation. TOKYO ELECTRON MB2-830 is compatible with numerous vacuum pumps, allowing for optimal operation conditions. The unit also offers remote access capabilities, allowing users to control the sputtering process from any location. VARIAN / TEL / TOKYO ELECTRON MB2-830 is an advanced sputtering machine designed to ensure efficient and uniform deposition of thin film layers on a variety of substrates. Its direct-cathode sputtering configuration and its numerous plasma monitoring, metering, and control capabilities ensure high-quality thin film depositions with excellent homogeneity. This tool is ideal for thin film research and advanced deposition processing.