Used VARIAN / TEL / TOKYO ELECTRON MBB 830 #9294765 for sale

VARIAN / TEL / TOKYO ELECTRON MBB 830 Sputter Equipment is a versatile, state-of-the-art deposition system for thin-film processes. This unit uses a combination of direct current (DC) and radio frequency (RF) power sources to sputter materials quickly and effectively. This machine can deposit metals, alloys, dielectrics, and semiconductor compounds in a variety of applications. It includes a DC Planar Magnetron sputter source, four independent RF Plus Planar Magnetron source, and three walls of Target or rotating drum-type Pelletron Source. The DC Planar Magnetron source provides the ability to sputter metals or dielectrics at low substrate temperatures, while the RF sources provide the thermal stability of reactive sputtering and the ability to sputter compounds. The Pelletron Source can be used for refractory metals or harder to sputter materials. The tool includes various other components to ensure a uniform film deposition. There is a bottom-mounted scanning mechanism that moved the substrate around the vacuum chamber. The substrate stage may be equipped with advanced control asset or with a multi-directional mechanical scanning that gives the operator more control and flexibility. The vacuum model includes the process chamber, gate valve, mechanical pumping equipment, and turbo pump to maintain vacuum level of 1 x 10-8 Torr on a continuous basis for the highest quality films. This system also includes a stainless steel glove box for the handling of substrates to minimize contamination. This sputtering unit is managed by an advanced programmable touch-screen controller that allows the operator to conveniently access all deposition parameters. In addition, users can personalize the parameters to their specific coating applications. TEL MBB 830 is designed for consistently efficient deposition of thin films. The machine's variable power settings can be adjusted for optimal deposition rates and uniformity. The sources can also be switched easily to adjust from one substrate to another. In addition, the tool comes with a small footprint and is a good choice for limited laboratory space. This asset provides high-performance sputtering capabilities with an easy to use graphical user interface.