Used VCR GROUP IBS / TM200S #9246303 for sale

VCR GROUP IBS / TM200S is a sputtering equipment, mainly used for the physical vapor deposition of thin films. It utilizes the power of ion bombardment during the thin film deposition process, which makes it particularly well-suited for PVD (Physical Vapor Deposition) technologies. IBS / TM200S is operated by a 9-axis motion control system, and is capable of creating various sputtering processes ranging from unidirectional to polarity reversed sputtering. The sputtering process utilizes a high-voltage power supply and cathode (target) along with a shield cathode to control the plasma and create the desired deposition thickness profile. The sputtering process is initiated when the target is bombarded with an ion beam. This bombardment heats the target surface, evaporating atoms which are then accelerated in a uniform, directionless beam toward the substrate which is in contact with the sputter chamber. As the energetic atoms travel towards the substrate it meets a shield that partially reflects the energetic atoms and allow the deposited film to form at the desired location. The thickness of the thin film can be adjusted by controlling the evaporation rate of the target material. VCR GROUP IBS / TM200S is specifically designed to improve the accuracy of deposition thickness, uniformity, and homogeneity of the film over large substrates. In addition to sputtering, IBS / TM200S is capable of controlled transport of wafers. It uses an automated wafer transfer unit to control both the wafer insertion and extraction from the sputter chamber. This machine acts as an end effector and is an important safety feature that ensures the safety of the sample. VCR GROUP IBS / TM200S is also equipped with features such as a load lock tool, closed loop thickness control asset and an auto-start up model. All of these features come together to make IBS / TM200S an ideal choice for physical vapor deposition applications.