Used ABA FFU 1500 / 60 #9052571 for sale

ABA FFU 1500 / 60 Wafer Grinding, Lapping & Polishing Equipment is designed to enable wafer production for the most critical microcircuit applications. This system features a high precision grinding and lapping table, precision metrology, and full machine automation. The unit performs fast, high accuracy grinding, lapping, and polishing on 3" to 8" wafers up to 4 mils of finish. The base of the machine features a high precision granite base, designed for smooth operation over recirculating ball bearing slides. It also features a 2000 lb capacity steel guide bar for accurate stiffness control. The stainless steel grinding table has is designed with electromagnetic force for full and consistent grinding pressure. The grinding table and bedplate are also both accessible from both the front and back for ease of operation. FFU 1500 / 60 also includes an internal 1600watt circle polishing tool. This asset features polishing discs that rotate at speeds up to 1500 RPM, and can polish at a constant pressure while continuously circulating coolant for minimal heat buildup. The model's spindle is capable of rotating at 15,000 RPM, and the safety shutoff feature will stop the machine if the spindle speed falls below a certain threshold. The wafer handling equipment is capable of rotational angles up to 360 degrees while providing precise positioning throughout the process. ABA FFU 1500 / 60 is designed for low maintenance operation and is energy efficient. The system has an adjustable inspection light for quality assurance processes, and the touch screen intuitive control panel is user friendly and able to save up to 10 program settings for automatic recall. Overall, FFU 1500 / 60 Wafer Grinding, Lapping & Polishing Unit is an ideal machine for meeting the most demanding microcircuit production applications. The tool features several advanced features, and its modular design is perfect for providing optimum performance for a variety of applications.