Used ACCRETECH / TSK PG 200 RM #9176435 for sale

ACCRETECH / TSK PG 200 RM is a versatile and precise wafer grinding, lapping and polishing equipment. It is designed for optimal grinding, lapping and polishing of semiconductor materials such as silicon, germanium and gallium arsenide. This wafer grinding system has a high-resolution measuring unit and a quick rotation speed for precise grinding and lapping. It is equipped with a 4-axis servo control unit for precise positioning and a high-performance spindle motor for high-precision grinding. TSK PG-200RM machine is capable of working with wafers up to 10" in diameter and 0.5 to 2.2mm in thickness. It has a fully automated, high-end machining tool with a programmable control asset that can be used to meet various process requirements. The wafer is mounted on a rotating work head and driven by servo motors. In addition, ACCRETECH PG 200RM model comes with a robot loader for wafer position adjustment and grinding. It also has an air-bearing spindle table that supports macro and micro grinding operations. The equipment has dual rotating grinding disks that are designed to deliver precise grinding results. An automated wafer transfer system also comes with the unit for easy and efficient wafer transport. PG 200 RM machine is designed for fast, precise grinding, lapping and polishing of semiconductor materials. Its high-resolution measuring unit and quick rotation speed make it perfect for precise grinding and lapping of various materials. The tool is equipped with a 4-axis servo control asset for precise positioning and a high-performance spindle motor for high-precision grinding. It also comes with a robot loader for wafer position adjustment and grinding, an automated wafer transfer model for easy and efficient wafer transport, and dual rotating grinding disks that are designed to deliver precise grinding results.