Used ACCRETECH / TSK PG 200 RM #9244028 for sale

ACCRETECH / TSK PG 200 RM is a high-end wafer grinding, lapping and polishing equipment designed to produce perfectly finished products for semiconductor and other microelectronic industries. Utilizing an advanced, double-sided, high-efficiency tool, TSK PG-200RM introduces advanced grinding, lapping, and polishing technology to the production process. With a grinding head that can move up to 100mm and a motor that reaches 30,000 rpm, ACCRETECH PG 200RM is capable of processing wafers in a single pass. Advanced high-precision compensation systems help ensure that the finished product is perfectly aligned in the X, Y, and Z axes and that the required surface-finish accuracy is achieved with speed and precision. The process is also monitored by a special optical alignment-checking system which utilizes the laser-beam alignment method to check whether the grinding and lapping surface is flat. Other features include Internal Pressure Equalization and Ambient Pressure Compensation which help ensure an even finish quality. In addition, PG 200 RM is equipped with the latest in-line auto cleaning and self-adjustment systems which help ensure consistent performance. The auto cleaning unit uses a special nozzle and magnetic-brush type air cleaning to remove wafer polishing particles from the grinding head and other parts of the machine. Furthermore, surfaces and parts subject to wear and tear can be self-adjusted through the auto-adjustment mechanism to ensure perfect positioning and smooth operation. Overall, ACCRETECH / TSK PG-200RM is a powerful and versatile wafer grinding, lapping and polishing tool that combines high precision and high speed processing capabilities. Its advanced features effectively increase productivity and accuracy by providing a solution to common production issues such as surface roughness, wafer warpage, and grinding head alignment.