Used ACCRETECH / TSK PG 200 RM #9281269 for sale
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ACCRETECH / TSK PG 200 RM is a state-of-the-art wafer grinding, lapping, and polishing equipment designed for quick, consistent, and reliable wafer surface preparation. It is a must-have for modern factories, as it offers automated polishing and grinding capabilities to provide the utmost in accuracy and precision for wafer finishing. The system is equipped with a computer-controlled rotary table and two overlapping grinding and lapping spindles, all powered by powerful motor drives that ensure repeatable, precise process control. It is designed with a robust mechanical construction and vibration dampening technologies to provide optimal wafer surface preparation performance. Its advanced grinding unit with a floating head helps ensure a perfectly flat, smooth surface finish, while the lapping machine creates a precise, uniform surface profile. At the core of the tool is an advanced, microprocessor-based control unit that allows for easy configuration and monitoring. This control unit provides automated, on-board diagnostics to monitor surface preparation, as well as monitor process temperatures, speeds, pressure, and other critical parameters. Also, interfacing with external computer systems is possible via the built-in Ethernet connection. The asset offers a vast selection of process options, allowing for minimal cycle times and maximum process repeatability. A variety of interchangeable diamond grinding wheels and lapping plates are available to accommodate a wide range of materials and wafers. For advanced efficiency, the machine is also compatible with functional consumables and accessories, like consumable cassettes, rough grinding cups, lapping flats, static lifter plates, and more. Overall, TSK PG-200RM is the perfect choice for on-site wafer grinding, lapping, and polishing, offering unbeatable accuracy, reliability, and cost-effectiveness. Its advanced operational and control features make it an ideal choice for both high-volume and fine precision processing.
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