Used ACCRETECH / TSK PG 200 #9217397 for sale

TOKYO PG 200 is a wafer grinding, lapping, and polishing equipment developed by TOKYO Electronics, which is a global leader in the electronics manufacturing industry. This system is designed for the precise, high-accuracy grinding, lapping, and polishing of wafers used in the semiconductor and electronics industries. Its features and specifications make it a valuable tool for achieving optimum wafer surface accuracy, texture, and flatness. PG 200 is equipped with an extra-wide bed of working platen size to ensure high accuracy and offer more surface access to grinding and polishing. Its digital drive unit has a high speed capacity (6,000 rpm) and a precise stepper motor that can control the grinding wheel to reduce polishing times, improving surface quality and flatness. The machine also features a non-contact servo speed drive, with which you can easily adjust the speed and force of the grinding wheel to meet the specific requirements of the application. The tool also has LED light indicators and stainless steel covers to protect its internal components from environmental damage. In addition, the easy-change polishing pads make it easy to switch out pads for different applications, and the high-accuracy scanning and centering asset makes it easy to align the polishing pads for processing. Furthermore, TOKYO PG 200 also has advanced closed loop control model that fine-tunes the processing parameters and delivers superior surface finish and flatness. This advanced control equipment also helps to increase the overall efficiency of the system. Overall, PG 200 is an advanced wafer grinding, lapping, and polishing unit that delivers the highest accuracy and excellent surface finish. Its powerful and precise features, along with its simple control machine, make it an ideal choice for semiconductor and electronics industries.