Used ACCRETECH / TSK PG 200 #9304254 for sale

ACCRETECH / TSK PG 200 is a multi-functional wafer grinding, lapping & polishing equipment designed to deliver the highest levels of efficiency in the manufacture of ultra-precision device structures. This advanced system features a patented planetary-drive unit designed to provide superior accuracy and repeatability. It is capable of handling both single- and double-device structures with no loss of accuracy, allowing for high-precision production, as well as the ability to process substrates with up to atomic-level accuracy. TSK PG 200 is equipped with a range of features to provide efficient processing and superior quality results, including a high-load spindle motor that can be configured to provide a grinding force of up to 5N and a rotational speed of up to 150,000 rpm. The machine also comes with an integrated lapping & polishing tool with tweezing capabilities that can be utilized for high-precision finishing operations. Additionally, the platform is capable of producing sub-micrometre surface roughness on all materials and substrates, ideal for an array of high-precision applications. In terms of operation, ACCRETECH PG200 is easy to use, providing users with reliable and intuitive control over each step in the wafer grinding process. The integrated control asset allows users to quickly and accurately configure grinding parameters such as depth, rotation speed, feed rate, and pressure. The model has two built-in video monitors, enabling users to view the grinding process in real-time and make quick adjustments on the fly, allowing for consistent results. One of the most efficient features of ACCRETECH PG 200 is its ability to be upgraded for different applications. This includes an optional rotary spindle for multi-plane grindings, wafer edge grinding, and single-point burr removal. Additionally, the equipment has expanded modular control capabilities that enable it to be integrated with an external computer, allowing users to control the grinding process from a remote location. To summarize, PG 200 is an advanced wafer grinding, lapping & polishing system built for manufacturing ultra-precision device structures. It features a high-load spindle motor and an integrated lapping & polishing unit and can produce sub-micrometre surface roughness on all materials and substrates, allowing for efficient and accurate operations. Its user-friendly interface, modular control capabilities, and upgradable features make it the ideal machine for ultra-precision device fabrication.