Used ACCRETECH / TSK PG 300 RM #293587256 for sale

ACCRETECH / TSK PG 300 RM Wafer Grinding, Lapping & Polishing Equipment is a precision processing system that provides ultra-flat surfaces and superior quality. With a range of features, including automatic material handling, lapping, clamping and inspection, the machine provides superior performance in the semiconductor industry. TSK PG300RM unit includes a micro processor-controlled base unit with a machine head, allowing for flexible and accurate surface processing. The machine's lapping stage begins with a diamond cup wheel mounted on a precision-controlled spindle to provide a superior and consistently flat surface on the wafer surface. The lapping parameters are adjustable to achieve a wide range of surface finish requirements. The lapping compound is applied in a thickness of less than 1 micron for ultra-precise polishing. Following the lapping, the wafer is polished using diamond polishing discs, or a diamond tooling accessories, such as a polishing cloth, to obtain a perfectly flat, ultra-fine surface. ACCRETECH PG 300RM further offers advanced material handling systems, such as automated Hoppers and carriers, to transfer the wafers from the lapping and polishing stages to the QA inspection station. The Hoppers, for example, load wafers into the machine's grinding head and automatically unload them into the inspection station. This automated machine enables quick and consistent grinding and lapping of the wafers, and results in highly uniform surfaces with low defects. Ideal for production of all types of wafers, TSK PG 300RM offers a high degree of versatility with its universal-fit features. The inspection station is equipped with high-powered digital microscopes to closely examine the surface of each wafer. With a scan resolution of up to 1 micron, the highest accuracy is always maintained. Additionally, the QA process involves a computer-controlled tool where operators can input wafer parameters and the machine will adjust its parameters accordingly. This enables the user to maintain a high level of precision during mass-production processes. PG300RM Wafer Grinding, Lapping & Polishing Tool offers a wide range of features designed to provide superior surface processing results. From automated Hoppers and carriers to a comprehensive QA inspection station, the machine enables superior quality, effectively processing ultra-flat surfaces with low defect levels. The versatility of the machine allows for various combinations of grinding, lapping, and polishing for maximum performance.