Used ACCRETECH / TSK PG 300 RM #293603611 for sale

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ID: 293603611
Wafer Size: 8"-12"
Vintage: 2007
Wafer back grinder, 8"-12" Wafer notch Wafer loading and unloading Dual spindles (4) UNIVERSAL Porous chuck tables Turntable Polishing table Peeling table Wafer mount table H1 Wafer handling pad LCD Touch screen Machine door with interlock Wafer mounter Back grind tape remover Roller mount Step down transformer Chiller Air dryer Vacuum pump Mixer UV Curer 2007 vintage.
ACCRETECH / TSK PG 300 RM is a wafer grinding, lapping and polishing equipment that features precise dimensional accuracy and high-density finish levels. This system is equipped with three spindles and a rotary pump to provide superior grinding, lapping and polishing capabilities. The spindles rotate at high rotational speeds as they prepare surfaces which are used as substrates in semiconductor and optoelectronic devices. TSK PG300RM is designed to provide precise, repeatable, and cost-effective grinding, lapping, and polishing operations. This machine is the perfect solution for applications that require a precise finish, such as lapping wafers for semiconductor components, optoelectronic devices, flat panel displays and magnetic heads. With programmable feed rates and precise spindle movements, grinding, lapping and polishing operations can be executed precisely and efficiently. ACCRETECH PG 300RM unit also provides users with various control options and customisable settings, allowing them to tailor their work process to suit the desired results. With its automated process control, user-friendly operation and intelligent software, the machine is capable of achieving uniform surface flatness and roughness levels. Additionally, the machine features a self-adjusting spindle, which ensures uniform forces across the grinding surface and the constant monitoring of process parameters, to ensure that each process is completed to the best possible standards. ACCRETECH PG300RM also offers a variety of safety features, such as automatic shutoff, over tempo prevention and a safety lock-out to protect operators during setup and operation. The tool is equipped with an array of sensors to monitor changing conditions and to alert operators of any abnormality. This ensures that the grinding and lapping processes are carried out safely and accurately. In summary, ACCRETECH / TSK PG 300RM is a robust and reliable wafer grinding, lapping and polishing asset designed to generate high-density finishes required for advanced electronics and optoelectronics devices. The model provides precise grinding and lapping with automated process control options and intelligent software. It is equipped with safety features to protect operators and ensure consistent results. With its advanced capabilities and versatile control options, ACCRETECH / TSK PG300RM is the perfect solution for precision grinding, lapping and polishing operations.
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