Used ACCRETECH / TSK PG 300 RM #293620674 for sale

ACCRETECH / TSK PG 300 RM is a fully automated grinding, lapping and polishing machine designed for pre-mill processes and thin wafer processing. It is engineered specifically to meet the performance and throughput requirements of semiconductor fabrication. The machine can process up to 300 wafers of 2" diameter at a time, providing excellent surface planarity and high yield in a short cycle time. TSK PG300RM is equipped with a high-precision air bearing spindle, allowing for controlled and precise grinding. Grinding is performed in a single pass by the use of multiple rotations of the spindle, so that it can grind the edge, center, and peripheral regions of each wafer. This method can produce a high surface flatness, lowering the warpage of the wafer and yielding a greater uniformity between individual wafers. The machine also features a unique lapping stage, wherein a uniform pressure is applied over the whole surface of the wafer using a set of pads of various sizes. This lapping technique allows for a smoother surface than conventional methods and enables a higher tolerance of wafer thickness variation. Polishing is done with the help of a diamond-charged pad, which provides a high-precision, attractive finish. This polishing stage produces the necessary surface finish required for further applications such as thin wafer processing and CMP polishing. ACCRETECH PG 300RM also possesses a high-performance motor and multiple sensors, which precisely measure the position of the wafer and the contact pressure between the grinding wheel, pads, and diamond pads. This enables a detailed analysis and elimination of defects which can reduce yield. Additionally, the machine is also equipped with a programmed data input interface, which allows an operator to store settings and processes. PG 300RM is an advanced wafer grinding, lapping and polishing system which offers excellent surface planarity, low cycle times, and high yield. The unique lapping and polishing stages allow for greater uniformity and a higher tolerance of wafer thickness variation, while the sensors and programmed data input interface provide for precise controlling and settings storage for improved manufacturing.