Used ACCRETECH / TSK PG 300 RM #293638996 for sale

ACCRETECH / TSK PG 300 RM Wafer Grinding, Lapping & Polishing equipment is a fully automated, multi-head, multi-functional precision grinding and polishing system. It is capable of performing several functions on a single wafer including grinding, lapping, polishing and slicing. The unit offers two independently variable grinding spindles and two lapping/polishing spindles, which enable it to process single- and multi-step processes. Its variable-speed spindles and adjustable pressure settings enable it to obtain superior surface finishes for both regular and irregular surfaces. TSK PG300RM's multiple media systems also facilitate a wide range of different surface treatments, ranging from deburring and sharpening to fine polishing. ACCRETECH PG 300RM's user-friendly control panel allows for complete machine control. The controller can be programmed according to a variety of process conditions and settings, and the program may also be updated or modified remotely. The machine displays process parameters in real-time, allowing the operator to monitor and control the entire process. In addition to the wafer grinding, lapping & polishing capabilities, TSK PG 300RM also provides advanced slicing, dicing and edge-treating functions. It is equipped with a high-precision, automatic vision tool capable of precisely recognizing the wafer size and shape, as well as locating, orienting and processing any single- or multiple-step cuts. TSK PG 300 RM's CCD vision asset enables the operator to perform a full range of inspection operations including particle contamination detection and contactless wafer sorting. The PLCI vision model can also operate in both high-speed continuous mode and step-and-repeat mode, ensuring maximum user convenience. Finally, ACCRETECH PG300RM's advanced safety features, such as its Emergency Stop button, motor isolation cover and front cover, provide peace of mind for operators. These features are designed to safeguard against potential hazards and ensure optimal safety and reliability when operating the equipment. In summary, PG300RM Wafer Grinding, Lapping & Polishing system provides superior wafer processing, slicing, dicing and edge-treating capabilities with a user-friendly control panel and CCD vision unit. Its advanced safety features and convenient remote program updating capabilities make it an ideal choice for any precision finishing application.