Used ACCRETECH / TSK PG 300 RM #293656992 for sale

ACCRETECH / TSK PG 300 RM is a next-generation wafer grinding, lapping, and polishing equipment that is truly state-of-the-art. Its robust construction and user-friendly design allow for accurate and efficient machining of high-value and complex wafers. TSK PG300RM is an advanced multi-functional machine featuring both vertical and horizontal spindles and a manually adjustable distance between the grinding tool and workpiece. This allows users to adjust the grinding tool to the ideal depth for particular wafer thicknesses, ensuring precision and repeatability. An inbuilt forced-air cooling is also available to keep the grinding slurry from overheating during continuous operation. ACCRETECH PG 300RM is equipped with an extensive range of wheel speeds and lapping speeds. The diamond grinding wheel is capable of grinding to a roughness of 0.5 Ra, and the lapping wheel is also capable of achieving a result of 0.5 Ra. This ensures a smooth, consistent result regardless of wafer thickness or material. TSK PG 300 RM includes a variety of safety features to protect the user and the equipment. The automatic emergency stop system can be initiated when the grinding wheel is overloaded or when the machine detects an abnormal operation. In addition, the unit is equipped with various sensors, such as an automatic unload/load sensor, a grindstone position sensor, and a clamp monitoring sensor, which ensure operational and safety standards are maintained. PG 300RM is also equipped with a touch-panel control interface, which basically eliminates the need for a dedicated operator. This allows for easy set-up and programming of the machine, as well as simple troubleshooting if a problem is encountered. Furthermore, the machine is designed with an advanced information collecting and controlling tool that displays operation log, grinding log, and other process-related data for later analysis. In summary, PG300RM is the ideal choice for users that desire a truly advanced wafer grinding, lapping, and polishing asset. Its robust construction and user-friendly design makes it ideal for accurately and efficiently machining high-value and complex wafers, and its variety of safety features ensure the user and the equipment are safe during operation.