Used ACCRETECH / TSK PG 300 RM #293657304 for sale

ACCRETECH / TSK PG 300 RM wafer grinding, lapping and polishing equipment is a multi-function system capable of performing a wide range of wafer grinding, lapping and polishing processes. TSK PG300RM unit delivers high precision results in a fast and efficient manner thanks to its advanced technology features. The machine is equipped with three independent grinding and two lapping spindles, plus a single polishing spindle, each with its own independent linear motor drives. This results in enhanced control over positional accuracy, which contributes to the tool's superior grinding and polishing results. The separate spindles provide complete process flexibility, allowing the user to perform a number of grinding, lapping and polishing operations on a single wafer without changing the tooling. This means maximum process efficiency and cost-effectiveness. In addition, ACCRETECH PG 300RM asset is equipped with a multi-position grinding/lapping head, that can grind, lap and polish simultaneously. A multiple wafer holder can also be employed for increased productivity. The model is designed for high levels of accuracy and repeatability, with a touchscreen control panel for easy operation and process set up. The equipment's numerical control (NC) system allows for operation without operator intervention, thus increasing total run time. The unit's brushes, belts, abrasive particles and lapping medium can be changed rapidly and easily for optimal results. TSK PG 300RM is fully programmable and features a comprehensive software package, which allows the user to store and quickly recall any given process parameters for repeatable processing. The software is also compatible with TSK Semiconductor Probing Software, allowing both manual and automated probing adjustments. The machine is protected by a durable dust cover and operates in a temperature-controlled environment, thereby minimizing the effect of dust and other environmental variables. In short, ACCRETECH / TSK PG 300RM is a highly capable machine, designed to deliver precise and repeatable wafer grinding, lapping and polishing results in a fast and efficient manner. Its range of advanced features and programmability make it the perfect solution for the most demanding production processes.