Used ACCRETECH / TSK PG 300 RM #293729465 for sale

ACCRETECH / TSK PG 300 RM is a compact, workshop engineered wafer grinding, lapping, and polishing equipment. It has been designed to provide high levels of consistency, repeatability, and quality in the grinding, lapping, and polishing of thin wafers of various sizes, shapes, and materials. TSK PG300RM is built upon a base platform that houses the main controller and the main wafer grinding/lapping/polishing system. This base platform also includes a spindle motor, chucks and wafer holders, as well as a motor for wafer transport. The spindle motor allows for precise grinding and lapping of the thin wafers at speeds ranging from 20 to 2000 RPM, and the motor for wafer transport helps ensure that each wafer is aligned and held securely during the process. The reliable drive motors and precise control unit ensures a smooth and uniform grinding, lapping, and polishing of the wafers. ACCRETECH PG 300RM also features an integrated dust collection machine that helps capture dust particles generated during the grinding and polishing processes. This ensures a clean working environment that keeps the wafers free from contamination. In addition to the base platform, TSK PG 300 RM has several optional components to customize the tool to your specific grinding, lapping, and polishing needs. These include a wafer cleaning asset, additional spindle motors, pick and place systems, and wafer fence contouring options. The overall package of PG 300RM offers superior performance, flexibility, and reliability; all of which are necessary when working with fragile and sensitive wafers. The systems integration capabilities allow the user to maximize the performance of the model while minimizing the cost associated with running the equipment. ACCRETECH PG 300 RM can be used to process various materials, including: silicon, quartz, ceramics, plastics, and others.