Used ACCRETECH / TSK PG 300 RM #293743894 for sale

ACCRETECH / TSK PG 300 RM is a sophisticated wafer grinding, lapping and polishing equipment for the fabrication of semi-conductor wafers. The system is made up of a grinding/lapping unit and a polishing unit, which are integrated into a single workbench unit. The grinding/lapping unit can be used for grinding, lapping and polishing of semi-conductor wafers up to 200mm in diameter. It is designed with a 9-axis CNC control to provide specialized functions such as indexing, contouring and micro-groove formation. The grinding/lapping unit also comes equipped with a closed-loop load cell that is used to monitor the load on the grinding plate during processing. The polishing unit is designed to provide highly precise and uniform polishing of semi-conductor wafers up to 200mm in diameter. Its main features include a CNC-controlled turntable with a 7-axis motion, allowing for high-precision and fine polishing. It is equipped with an extremely precise pressure sensor for precise and repeatable pressure control, along with an AQS machine for automatic application of the required polishing media. TSK PG300RM also features an integrated air filtration tool and a dust filter, ensuring dust-free and clean polishing process. With its first-of-its-kind design, ACCRETECH PG 300RM has set a new standard in wafer preparation technology. With a unique combination of grinding, lapping, and polishing capabilities, PG 300 RM is able to deliver the most precise and uniform finish possible on semi-conductor wafers. This makes it an ideal choice for the most precise and precise wafer preparation applications, such as manufacturing of small precision parts, thin films, and thin layers, adding value to the process with exceptional results.