Used ACCRETECH / TSK PG 300 RM #293755522 for sale

ACCRETECH / TSK PG 300 RM is a wafer grinding, lapping and polishing equipment specially designed to manipulate and process silicon, quartz, sapphire, and other semiconductor and non-semiconductor materials. It is suitable for a wide range of applications, from general polishing to extremely fine-grained precision finishes. TSK PG300RM consists of a long platform with a motorized head that slides across the platform, powered by a variable-speed drive motor. The machine is equipped with a three-axis stage consisting of two linear axes and a rotary axis, with a high-precision feedback and direct drive-controlled servo motor for precise positioning. On the platform is a polished steel anvil for accurate positioning of the wafers. The machine includes an airtight glass vacuum hood that helps to minimize airflow over the area while allowing contact with the wafer. The hood has an automatic chucking system that can accommodate wafers of different sizes. The hood also includes a coolant unit to keep the temperature of the wafer within a certain range. ACCRETECH PG 300RM also comes with a touch screen operator interface and an intuitive menu machine to guide the user through the grinding, lapping and polishing processes. It also includes a programmable logic controller (PLC) for automated operation. The double-sided, abrasive discs can be used to grind, lap, and polish the wafer surfaces. The spindle motor is able to hold and rotate the discs at up to 2500 rpm for precise and consistent grinding and polishing. An air-lift tool makes it easy to replace or remove the discs. To ensure a consistent finish, the spindle motor has a pulse-width modulation asset that allows varying the speed of the motor while maintaining a constant force on the wafer. The machine can be operated either in manual or automated mode and automatically adjusts parameters such as pressure, rotation direction, and speed for each material type and application. It also includes an automatic thickness measurement model and an auto-stop function that stops the machine when the desired thickness is reached. ACCRETECH PG300RM is a highly advanced wafer grinding, lapping and polishing equipment that offers precision control and consistent finishes. It is an ideal machine for use in a wide range of applications, from basic processing to fine polishing.