Used ACCRETECH / TSK PG 300 RM #293770464 for sale

ACCRETECH / TSK PG 300 RM is a high-speed, fully programmable, and automated wafer grinding, lapping, and polishing equipment. This system is designed to provide precision quality results, quickly and efficiently. The unit utilizes multiple customizable processes which produces high quality results. It contains a five-axis precision positioning table which allows for accurate control of grinding and polishing processes. There is also a high-speed grinding motor for cutting and processing 200 to 300 mm wafers. The machine provides fast and easy setup and operation utilizing user-friendly touchscreen interface. The tool is capable of processing multiple wafer sizes, including 200-millimeter diameter, and can achieve surface quality finishes under 2 μ and roughness up to 50nm. It uses a two-stage grinding process that increases accuracy and ensures higher production yields. The asset contains an ultra-precision spindle motor for lapping and polishing that utilizes a six-axis motion program. This provides a higher level of accuracy and repeatability than traditional methods. TSK PG300RM has a range of adjustability and control features including automated processes, automatic wafer centering, and pressure control. It also contains a vacuum dispenser to ensure efficient extraction of particles from the process surface. The entire grinding, lapping, and polishing process is designed to reduce cycle times. This model also includes safety features such as an emergency stop button, interlock loading/unloading, and hand-touch protection to ensure user safety. This versatile and robust equipment is perfect for mass production and research and development applications. The system delivers precise, repeatable, and highly automated results that can be precisely tailored to the specific needs of the customer. In addition, the unit is very simple to operate and maintain.