Used ACCRETECH / TSK PG 300 RM #293799621 for sale

ACCRETECH / TSK PG 300 RM is a fully automated wafer grinding, lapping, and polishing equipment designed for processes used in the semiconductor, LED, and photovoltaic industries. The system is also designed to meet the needs of research & development and non-metal cutting grinding and polishing requirements of customers. The Wafer Grinding, Lapping and Polishing Exchange Unit features load-lock processing and circulating-lock processing to provide a flexible wafer rotation machine. The tool is designed for window processing of multiple wafers, with each window supporting single wafer sizes from 25mm to 200mm, and different types of circular, square, and rectangular cutouts on a single substrate. The asset has 3-axis machining capability in X, Y and Z directions, providing up to 6-axis movement during wafer exchange. The wafer cassette and carrier are automatically exchanged, ensuring a secure and reliable process. In addition to wafer grinding, the model features lapping and polishing with a range of ceramic, diamond, and other types of abrasives. A high degree of accuracy is maintained through the use of pressure sensing for flatness control and consistent surface finish. The equipment is equipped with an easy-to-operate touchscreen, allowing for manual and automated process monitoring and control. The system also includes a durable protection unit to prevent unwanted physical contact during operation, and a vision machine to automatically detect cracks and other imperfections. The process can be further customized according to user needs, with bi-directional communication, support control, and maintenance functions. TSK PG300RM is equipped with a variety of industry standard options, including 3-stage scrubbing and air-clamping processes, a round processing capability, over-sizing applications, and automated nozzle cleaning. The tool also includes a dedicated return station and a water/dust-proof housing. Overall, ACCRETECH PG 300RM is an ideal choice for high precision wafer grinding, lapping, and polishing processes.