Used ACCRETECH / TSK PG 300 RM #293816760 for sale

ACCRETECH / TSK PG 300 RM is a wafer grinding, lapping & polishing equipment engineered to provide maximum flexibility with minimal cost. It is designed to meet the needs of the high-volume semiconductor industry, enabling research laboratories and companies to produce microelectronic components with tight tolerances and improved yield. This system uses special grinding and polishing technologies to provide extremely precise manufacturing results, reducing defects and improving the overall quality of the end product. At its core is the PG-300 rotary grinder, which features an ultra-precise brushless motor and a wide platen design for precision grinding operations. It can be used to accurately grind flat, round, and angled surfaces in a variety of materials. The PG-300 can handle wafers up to 8" in diameter, making it ideal for producing high-volume semiconductor components. TSK PG300RM is equipped with a high-performance lapping head, featuring a double-stage dispense unit with a 10-step, micro-adjustable controller. This allows for extremely accurate and consistent polishing processes over the entire surface of the wafer. The lapping head has a wide range of available force settings, allowing for precise control over the grinding and lapping results. ACCRETECH PG 300RM also features an adjustable, programmable robot arm for mounting the wafers to the lapping head. This ensures that the wafers are properly seated during lapping and polishing processes, and allows operators to quickly and easily change wafer sizes and geometries. PG 300RM is outfitted with several safety features to reduce operator fatigue and prevent accidents. For example, it features a durable base that minimizes vibration, and the grinder is enclosed with a transparent safety shield to guard against injuries. Overall, ACCRETECH PG300RM is an excellent choice for high-volume wafer grinding, lapping, and polishing operations. Its dedicated grinding and lapping heads provide highly precise results, while its adjustable robot arm allows operators to quickly and easily change wafer sizes and geometries. Additionally, several safety features are integrated into the machine to ensure maximum operator safety.