Used ACCRETECH / TSK PG 300 RM #9113982 for sale

ACCRETECH / TSK PG 300 RM is a precision wafer grinding, lapping, and polishing equipment. This system is designed for producing ultra-smooth surfaces on wafers for a wide range of applications, such as semiconductor, MEMS, and optical components. The unit is capable of performing a variety of operations, such as coarse grinding, lapping, ultra-fine polishing, and flattening of wafers. The primary components of TSK PG300RM include a rotary grinder, lapping table, and polishing table. The rotary grinder is used for coarse grinding, which is the first step in the process. This step reduces the surface roughness of the wafer to a certain level. The lapping table is used for the lapping step. This step involves the use of abrasive particles to further reduce the wafer's surface roughness. The polishing table is then used for the actual polishing process. This involves the use of diamond slurries and other polishing materials to further refine the surface. ACCRETECH PG 300RM also features multiple grinding and polishing settings that can be adjusted to accommodate different applications and wafer sizes. Additionally, the machine is equipped with a digital panel that provides visual indications of the relative surface roughness of the wafer. This panel allows operators to make quick and accurate adjustments to the grinding and polishing settings to ensure that the optimal surface quality is achieved. ACCRETECH / TSK PG 300RM is designed for high-precision grinding and polishing with a high degree of accuracy. This tool is capable of producing ultra-smooth surfaces on a variety of wafer materials, with clean and low-particle surfaces. Additionally, the asset offers low operating costs and outstanding reliability. Overall, TSK PG 300RM is an advanced wafer grinding, lapping, and polishing model. It offers high precision, versatile performance, and reliable operation. This equipment is the ideal choice for producing ultra-smooth wafer surfaces for various applications.