Used ACCRETECH / TSK PG 300 RM #9152292 for sale

ACCRETECH / TSK PG 300 RM is a high-end wafer grinding, lapping and polishing system designed for semiconductor fabrication. The machine is capable of producing parts with excellent surface finishes, thanks to its versatile and highly automated grinding processes. TSK PG300RM is equipped with a 9-step grinder head that is capable of accommodating substrates up to 6.0" in diameter and up to 1" thick. The grinder head is driven by a multi-speed, direct-drive motor, which is capable of providing speeds ranging from 100 to 10,000 RPM. The motion of the head is directly monitored by a three-axis encoder that provides feedback on its grinding action and is coupled with a servo motor. ACCRETECH PG 300RM utilizes a diamond-coated grinding wheel to achieve precise grinding. An external pressure regulator is provided for increased accuracy, allowing the operator to set a specific pressure for the grinding head to maintain during the grinding process. The system also features automatic clearance and manual sliding to ensure that the grinding wheel does not come into contact with the substrate. The machine also includes a lapping station that can accommodate a maximum height of 1" and a maximum substrate diameter of 6.0". The lapping station is capable of vertically moving up to 902 degrees to adjust the lapping pressure. The lapping station is adjustable to accommodate a variety of substrates and sizes. Finally, the system features a polishing station with a vibratory action. This is designed to quickly and accurately polish the substrate. The polishing station can accommodate substrates up to 6.0" in diameter and up to 1" thick. PG 300RM is an indispensable tool for precision semiconductor production, offering a high degree of accuracy and precision while greatly reducing the time and cost of production.