Used ACCRETECH / TSK PG 300 RM #9183184 for sale

ACCRETECH / TSK PG 300 RM is a state-of-the-art precision wafer grinding, lapping and polishing equipment designed to provide superior quality, consistency and repeatability. The system has been specifically designed to meet semiconductor industry requirements for the grinding and lap-polishing of very thin, fragile wafers. The unit features a precision wafer grinding spindle equipped with high-speed, high-torque rotating diamond wheel to grind down the edges of wafers as thin as 3 mils (75 μm) with exceptional uniformity and repeatability. An adjustable two-stage wafer feed mechanism is incorporated to ensure the uniform feed angle essential for consistent wafer processing. The spindle has a variable speed AC servo drive machine for optimum grinding, lapping and polishing performance and provides precision, stability and repeatability. In addition, the tool includes two-stage lapping and polishing configurations with rotating lap plates. A variety of lap plates are available including soft, medium and hard grades, as well as matched sets allowing for precise control of the polishing process. The rotary lap plates are driven by servo motors that provide efficient and accurate polishing. TSK PG300RM is equipped with a high-performance, computer-controlled vacuum chuck for wafer loading and unloading. The vacuum chuck is capable of secure holding of wafers up to 8-inch square and 12-inch diameter and has an automatic chucking mechanism for easy wafer loading. The asset is all-semiconductor compatible and features an integrated particle counter for real-time monitoring of the process environment. Other features of the model include a safety enclosure to protect operators from dust and debris, an adjustable mirror illumination equipment for visual monitoring and verification of the completed wafer, a touch-screen monitor and keyboard for easy system control/programming, and dynamic cooling for effective temperature management. Overall, ACCRETECH PG 300RM is an extremely accurate, reliable and user-friendly unit able to provide superior quality, consistency and repeatability in wafer grinding, lapping and polishing processes. It is the preferred machine for precision microfabrication and is an ideal choice for those involved in the production of integrated circuits.