Used ACCRETECH / TSK PG 300 RM #9190398 for sale

ACCRETECH / TSK PG 300 RM is a fully automated wafer grinding, lapping and polishing equipment designed for the semiconductor industry. It is specifically designed for single-side and double-side processing of wafers up to 300 mm in size. The system is capable of performing single-side grinding and lapping, single-side polishing, and double-side polishing for a variety of different wafers including Silicon, Sapphire, Quartz, and Copper. TSK PG300RM includes a grinding/lapping table with 2 work piece stages, a polishing head, a coated abrasive belt drive and feed unit, a polishing plate with a rotating stage, a polishing head tilt control, a polishing cloth attachment machine, and a polishing media/liquid disperser tool. All of these components work together to provide a complete automated wafer processing solution. The asset also features an integrated PC interface, allowing for easy integration into a factory automation model. ACCRETECH PG 300RM utilizes a state-of-the-art abrasive belt drive and feed equipment to position the abrasive belt onto the grinding/lapping table. This system utilizes a belt-tensioning device to ensure uniform abrasive belt pressure against the workpiece during grinding/lapping. The workpiece is driven onto the belt through a pneumatically controlled unit, ensuring uniform positioning of the workpiece onto the belt. For single-side polishing, PG300RM is equipped with a polishing head, which uses a tilting mechanism to adjust the angle of the polishing surface to the workpiece. This adjustable angle ensures uniform polishing conditions and uniform removal of imperfections in the wafer surface. A polishing cloth attachment machine is also included, which uses a vacuum to attach cloth pieces to the polishing head. This cloth attachment tool ensures uniform coverage of the wafer surface during polishing for optimal polishing results. Finally, ACCRETECH / TSK PG300RM uses a polishing media/liquid disperser asset to control the distribution of polishing media or slurry to the workpiece. This model utilizes an adjustable media shower to ensure uniform dispersal of the polishing media or slurry across the wafer surface. This uniform dispersal ensures uniform polishing results, regardless of the size of the wafer or its imperfections. Overall, ACCRETECH PG 300 RM is a powerful and reliable automated wafer grinding, lapping and polishing equipment designed to meet the high accuracy and productivity demands of today's semiconductor industry. Its advanced abrasive belt drive and feed system, adjustable polishing head, polishing cloth attachment unit, and media/liquid disperser machine ensure uniform results over a variety of wafer sizes and imperfections. This tool is an ideal choice for wafer processing applications.