Used ACCRETECH / TSK PG 300 RM #9200072 for sale
URL successfully copied!
Tap to zoom
ID: 9200072
Wafer Size: 12"
Vintage: 2005
Wafer backside grinder, 12"
P75 Slurry
OMEGA VUT600-1006-A Vacuum pump
ADVANCE WAVE VSP-32100S Voltage Sag Protector (VSP)
Hand-1 unit
Air dryer
Chiller
UV Unit
2005 vintage.
ACCRETECH / TSK PG 300 RM is a wafer grinding, lapping, and polishing equipment which utilizes a variety of different tools and processes in order to achieve flat, smooth, and highly accurate surface finishes on the wafers within the system. The unit is equipped with a three-stage rotating precision platens, each of which is separately powered and equipped with separate speed and stroke regulators. These platens each serve a unique purpose within the machine. The first platen is a low speed, low amplitude grinding stage which assists in the removal of burrs and ridges from the wafer. The second platen uses a higher speed and features a higher amplitude in order to grind the wafers to a higher degree and create a smoother, more level surface finish. The third platen is a lapping and polishing stage, capable of producing a mirror-like finish on the wafer. This platen uses a combination of chemical compound or lubricant and abrasive particles to polish the wafer. TSK PG300RM utilizes a programmable control tool for the process parameters, including speed, stroke, and pressure. Additionally, the asset is equipped with an automatic wafer handling model, which allows for quick and efficient loading and unloading of the wafers without manual intervention. Sensors in the platen base assist in the pressing, tightening, and release of the wafer for the grinding process as needed. ACCRETECH PG 300RM also features a range of safety and maintenance features designed to extend the life of the equipment and minimize downtime during maintenance or repairs. These features include an auto-stop feature, dust-proof shields, and emergency stop buttons. Additionally, a temperature monitoring system with alarms and cooling fans can be used to ensure that the unit is operating within its temperature limits. In conclusion, PG 300RM is a versatile and powerful wafer grinding, lapping, and polishing machine. Its programmable control tool, automated wafer handling, and safety features allow for quick and efficient processing of wafers with consistent, high quality results.
There are no reviews yet