Used ACCRETECH / TSK PG 300 RM #9222656 for sale

ACCRETECH / TSK PG 300 RM is an innovative wafer grinding, lapping, and polishing equipment. It is a reliable, high-precision processing method used for ultra-thin wafer applications. The system improves production processes by reducing product handling time and increasing the industry's yield. The unit offers several features, including customizable wafer carriers that allow customers to customize the amount of material to be processed. Additionally, its processing chamber is equipped with a temperature control machine that ensures uniformity in the processing of temperature-sensitive materials. The machine provides high-precision surface lapping and polishing of wafers with improved quality. The unit offers a multi zone lapping process to polish a wafer surface to be super smooth and with low surface defects. The wafers can be processed with a grinding wheel, diamond cutting wheel, induction heating device, four face grinding machines, etc. It also ensures precise performance in both the grinding and polishing steps. The machine has an automated operation controlled by PLC for increased efficiency and accuracy. It further consists of an automatic loading tool ensuring error-free operations and improved wafer de-processing. A central electronic electronic controlling unit manages all the operational data and provides information about the current process status. Furthermore, the machine is equipped with two independent optical systems to check the quality of the wafers. Moreover, real-time analysis can be done to detect any process abnormality and take necessary action or preventive measure to enhance processing quality. The unit also provides a standardized control stopper, ensuring the accuracy of the grinding process. The machine is also equipped with an interlock mechanism, which prevents operation when there is a fault or asset error. Additionally, it is equipped with a clean room environment to minimize wafer contamination. TSK PG300RM is suitable for both 60° and 90° wafers and can be used on materials ranging from single crystal silicon to high-purity quartz. Overall, ACCRETECH PG 300RM is a reliable, high-precision wafer grinding, lapping, and polishing model. Its features and specifications make it an efficient and cost-effective solution for wafer processing and production. It provides ultra-precise results, thanks to its automated operation controlled by a PLC, interlock mechanism, optical equipment, and cleanroom environment.