Used ACCRETECH / TSK PG 300 RM #9244027 for sale

ACCRETECH / TSK PG 300 RM is a fully-automated, multi-process wafer grinding, lapping and polishing equipment specifically designed to precision grind, lap, and polish a wide variety of semiconductor wafers to tight control specifications. This system is composed of flexible, modular hardware components combined with a high-performance, Windows-based PC control unit, allowing it to be used in a variety of configurations. The machine can accommodate a variety of substrates, including silicon, glass, quartz, GaAs, sapphire, and ScS (supermolecular). The parts are loaded and unloaded from individual cassettes that are mounted on an automated carousel. The process starts by grinding or lapping of the wafer surfaces using diamond-infused grinding wheels, followed by defect removal and multiple polishing steps. The process is fully automated to ensure maximum accuracy and reliability. The programming tool is highly intuitive and offers the user complete control over the process. The grinding/lapping and polishing components of the asset are powered by a variable-frequency drive (VFD) with speeds ranging from 10-150HZ. The wobble drive provides a uniform grind, and is adjustable to accommodate different wafer sizes and shapes. In addition, the drive is equipped with an antipeding model to reduce grinding wheel wear and tear. The process parameters are monitored and controlled using a dual-axis motion controller, and machining accuracy is ensured by the use of absolute/relative feedback. The process is highly repeatable, making it suitable for mass production of wafers. In addition to its standard features, users can customize the equipment with multiple options. These include a vibration dampening system, a pneumatic clamping unit, and a front door safety switch, as well as custom tooling. TSK PG300RM is an advanced wafer grinding, lapping and polishing machine that offers the user complete control over the process for maximum accuracy and reliability. Its flexibility, intuitive programming tool and a range of customizable options make it an ideal choice for precision grinding, lapping and polishing of a variety of semiconductor wafers.