Used ACCRETECH / TSK PG 300 RM #9257684 for sale

ACCRETECH / TSK PG 300 RM is an automated wafer grinding, lapping and polishing system used in the fabrication of semiconductor device wafers. It is designed to meet the exacting requirements of the semiconductor industry, offering superior process control and repeatability as well as providing a high quality surface finish for even the most delicate silicon wafers. TSK PG300RM consists of a polishing stage, lapping stage and grinding stage with each stage featuring its own motorized controller and automatic adjustment of pressure, speed and time variables. The system includes programmable contouring functions such as pattern grinding, taper grinding, and surface texturing to achieve intricate shapes and feature sizes with minimal material removal. The grinding stage uses a diamond grinding wheel to abrade the wafer surface using parameters that are configurable to minimize the grinding force and make grinding more efficient. The lapping stage uses a diamond lap to polish the wafer surface to a precise depth and profile according to exacting specifications. The polishing stage uses a polishing pad in combination with diamond slurries to achieve a perfect, uniform finish. This combination of grinding, lapping and polishing ensures improved uniformity and higher quality end-products. In addition to its precise control capabilities, ACCRETECH PG 300RM also features whole wafer loading and unloading functions, enhanced wafer alignment detection to reduce the possibility of wafer breakage and improved heat dissipation to reduce warp or distortion of the wafer surface due to heat build-up. ACCRETECH PG 300 RM is an excellent choice for wafer grinding, lapping and polishing as it offers increased repeatability and precise control, improved process optimization, sensitivity and uniformity in the end-products. This makes it ideal for the manufacture of semiconductor devices with high-reliability and low-cost.