Used ACCRETECH / TSK PG 300 RM #9360277 for sale

ACCRETECH / TSK PG 300 RM is a state-of-the-art wafer grinding, lapping, and polishing equipment used by many of today's leading semiconductor manufacturers. This system is ideal for high-precision, low-defects applications such as the creation of silicon wafers and the production of modern integrated circuits. The innovative design of TSK PG300RM eliminates the need for large and expensive spent grinding and polishing fixtures, instead using a "belt" design to conduct the grinding, lapping, and polishing process. This flexible design allows for precise stability and minimal settling of the wafers, resulting in a much higher yield and lower defect rate than traditional systems. The wafers to be processed are held securely in place by a four-chuck mechanical unit that holds up to four wafers at a time with an adjustable clamping force. The machine utilizes two rotating tables to support and distributethe forces of the grinding, lapping, and polishing process evenly over the entire surface of the sample wafer. A sophisticated grinding and lapping algorithm is employed which eliminates the need for large grinding fixtures and ensures high-precision workpieces regardless of size or shape. The maximum sample diameter is 300 mm, with size adjustments capable of tolerances within ± 30 microns. ACCRETECH PG 300RM also offers automated inspection with vision inspection capabilities including surface evaluation and feature extraction. The tool also offers a range offlexible polishing options, including mirror, Matt, straight angle, and cross angle. The polishing asset can also achieve high-precision, high-quality finishes at a very low cost. Moreover, the automatic loading and unloading capability offered by ACCRETECH PG300RM further improves throughput and reliability. PG300RM Wafer Grinding, Lapping & Polishing Model is a powerful and precise equipment, capable of producing high-quality results and low defect rates for just about any use case. With features such as automated inspection, adjustable grinding and lapping forces, adjustable polishing forces, and automatic loading and unloading, the system can deliver superior results quickly and consistently.