Used ACCRETECH / TSK PG 300 RM #9387025 for sale

ACCRETECH / TSK PG 300 RM is a high-tech wafer grinding, lapping and polishing equipment designed for precision application in the semiconductor industries. It is an automated system of flexible grinding, lapping, and polishing designed for accuracy, speed, and repeatability in all stages of processing. The unit uses advanced technologies to combine automated features with precision control, giving users the ability to monitor their processes in real-time without manual intervention. TSK PG300RM features a rigid casting construction and state-of-the-art motor and control systems for the most accurate and repeatable results. The machine is designed for simple operation, with automated tooling, crystal isolation tool, software, and process automation for maximum control and flexibility. ACCRETECH PG 300RM is equipped with an "active lift" asset that automatically positions the wafer accurately and quickly without the use of manual lifting devices. The wafer holder utilizes electrical contact power pulses generated directly from the grinding spindle, allowing the user to control the lift motion for highly accurate results. It also features an open ended polishing model that can handle crystal sizes up to 300mm in diameter with either manual or automated positioning. The unique open-ended design allows for more control over polishing, resulting in smoother, more uniform surface finishes. The machine uses a variety of abrasives to achieve a wide range of grinding, lapping, and polishing results. The selection of grinding media includes diamond, aluminum oxide, silicon carbide, and silicon nitride. A variety of lapping and polishing pastes are also available for a wide range of surface finishes ranging from ultra-smooth to ultra-rough. Finally, ACCRETECH PG300RM equipment is fully expandable to meet virtually any processing requirement. The system can be customized with the addition of optional equipment such as robot transfer stations, wafer inspection systems, and automated loading systems. The unit also supports a wide variety of software utilities for communication, data collection and analysis, and process control. PG 300RM is an advanced wafer grinding, lapping and polishing machine providing unparalleled accuracy, speed, and reliability. With its advanced motor and control systems, automated features, expansive configurability, and expandability, it is the perfect solution for any application requiring precise results in the semiconductor industry.