Used ACCRETECH / TSK PG 300 RM #9396416 for sale

TheACCRETECHACCRETECH / TSK PG 300 RM is a fully automated, precision wafer grinding, lapping and polishing equipment developed for semiconductor devices, such as III-V compound, mems and discrete devices. This system provides superior backside wafer flatness and high throughput due to its unique, proprietary feature - the Automated Re-circulating Wafer Mapping Unit™ (ARMS). TSK PG300RM is capable of grinding, lapping and polishing multiple wafers up to 300mm in diameter. This machine utilizes a pressure roller to apply an evenly distributed load across the wafer resulting in a flat, uniform polished back side with minimal surface roughness. For more challenging substrates and applications, the tool is capable of achieving flatness as low as 10nm Edge to Edge Total Thickness Variation (ETTV). The asset is designed for ultra-fast wafer processing with speeds up to 18,000rpm and a precise rotational control of +0.00025°. It features an automated recipe that allows users to save parameters and process wafer following a defined program. It is equipped with a loading station that ensures a secure wafer centering on the chuck, reducing wrinkle and crack damages. It is capable of processing up to four wafers at a time, reducing waiting time between grinding, lapping and polishing steps. For more demanding applications, ACCRETECH PG 300RM includes a seven-zone circulation mode, which can further decrease total cycle time. Overall, PG300RM is an advanced, automated wafer grinding, lapping and polishing model designed for large sized substrates. This equipment provides superior surface flatness and superior throughput, enabling increased production yields and optimum quality for III-V compound, mems and discrete devices.