Used ACCRETECH / TSK PG 3000 RM #293592002 for sale

ACCRETECH / TSK PG 3000 RM is a multi-purpose, high precision grinding, lapping, and polishing equipment for semiconductor, magnetic and optical components. The machine is designed to meet the demanding requirements of producing large quantities of parts with superior accuracy and surface quality. TSK PG 3000 RM features a fully integrated design, consisting of a solid-state, compact mechanism and an advanced servo control software. The servo motors enable the high speeds and accuracy required for grinding and polishing, up to 0.1 micron tolerance. The open bed configuration allows for easy loading and unloading of parts, and can accommodate wafers up to 200 millimeters in diameter. ACCRETECH PG 3000 RM has a modular design with the capability to handle both wet and dry grinding applications, as well as full lapping and polishing operations. The machine is equipped with a secondary drive unit and dual force vector system, enabling it to apply constant force vectors to the work-piece throughout the grinding and polishing cycle. The machine also comes with a high precision spindle unit, enabling fast and accurate grinding and lapping processes. PG 3000 RM is designed for ease of setup and operation. The user interface is intuitive and easy to use, allowing operators to quickly configure the machine for specific tasks. The machine also comes with a full range of safety and sensing features, such as limit switches and over-travel detectors. ACCRETECH / TSK PG 3000 RM offers excellent process performance, with a maximum grinding speed of 30,000 RPM, a grinding pressure of up to 15,000 psi, and a maximum polishing pressure of up to 2,000 psi. The grinding and polishing cycle times can also be varied to achieve the desired results. The tool includes a temperature regulation feature, allowing repeatable process temperatures up to 150 degrees Celsius. TSK PG 3000 RM is an ideal choice for producing high-quality wafers and components with superior accuracy, surface finish, and cost-effectiveness.