Used ACCRETECH / TSK PG 3000 RM #9397446 for sale

ACCRETECH / TSK PG 3000 RM is a state-of-the-art wafer grinding, lapping, and polishing equipment designed to produce consistently high-quality surface finishes on a variety of silicon and compound semiconductor materials. This system utilizes an innovative air-bearing spindle grinding mechanism to deliver superior grinding results, while the lapping platen ensures an even lap over the wafer's entire surface. The RCM polishing heads then further refine the desired surface finish while maintaining the uniformity of the lapped surface even after a long grind-lap-polish cycle. In addition, this unit is unique in its ability to be combined with various polishing slurry solutions in order to source a wide variety of degrees of polish such as scratches and dings removal, buffing and finally polishing. For superior grinding results, TSK PG 3000 RM utilizes a precision spindle motor that is mounted on air bearings which ensures a very smooth and consistent grinding action. In addition, it features an advanced diamond wheel truing and rough grinding capability to further improve the quality and uniformity of the output. Moreover, this machine features a lapping and polishing head speed control which allows for superior surface finish quality on both prime and non-prime wafers. Moreover, the water-cooled polishing head of this tool ensures reliable and safe operation, while the unique polishing wheel head design ensures that the wheel is put in optimal contact with the wafer without causing any distortion or damage. The advanced feature set of ACCRETECH PG 3000 RM allows operators to customize their grinding, lapping and polishing cycles as per their needs and requirements. For instance, the asset includes an intuitive graphical user interface that makes it easy to set up and monitor the various parameters of the grinding, lapping and polishing cycles. The performance of the model can also be monitored in real time using an intelligent diagnostic equipment. Other features of this system include a spindle bearing wear monitor, a power efficiency monitor, a temperature monitor, and many more. In addition, this unit comes with a variety of tools which can be used for evaluation and for setting up process parameters for optimal results. Overall, PG 3000 RM is a powerful wafer grinding, lapping and polishing machine that is specifically designed for achieving consistent and high-quality surface finishes on a variety of semiconductor materials. Thanks to its advanced features, it can help operators achieve their desired output quickly and efficiently.