Used ACCRETECH / TSK TS-6W-R #9223099 for sale

ACCRETECH / TSK TS-6W-R is a wafer grinding, lapping and polishing equipment that is designed to achieve high precision results in a short period of time. This system is capable of producing wafers with a surface roughness of 0.1 µm or less, by allowing the grinding and polishing parameters to be adjusted. The layer-interference flatness achieved by this unit is ± 0.01 µm due to the optimal flatness between the lapping plates. TSK TS-6W-R is a 6" wafer grinding, lapping and polishing machine that has the capability to process a wide range of materials, from silicon to gallium nitride (GaN). The process is completed in a clean chamber with a controlled temperature and compressed air environment, which minimizes the possibility of contamination. An easy-to-use touchscreen panel allows the operator to adjust the grinding, lapping, and polishing parameters as needed. The tool is equipped with two friction-type spindle drives and two spindle guide plates that control the horizontal movement of the robot arm. This allows the robot to move while keeping the wafer flat in order to grind and lap the wafer. The asset is equipped with a high resolution camera which allows the operator to view the wafer's progress during the grinding and lapping process. ACCRETECH TS-6W-R model contains a direct feedback sensor that calculates the surface roughness of the wafer and a roughness Measuring Unit (RMU) which can measure the roughness at discrete points on the wafer's surface. This equipment also includes a unique dust collection system which keeps the environment clean by collecting all the dust from the grinding process. TS-6W-R unit is powered by a 3-phase AC motor and three-phase AC motor with a frequency drive to ensure that the grinding, lapping and polishing process is consistently executed. The machine is designed to easily configure the grinding, lapping and polishing parameter to meet the demands of different types of material processing. In conclusion, ACCRETECH / TSK TS-6W-R is a versatile wafer grinding,lapping and polishing tool. It is able to process a wide range of materials, has a high resolution camera, and a dust collection asset which helps to keep the environment clean. The model is designed to easily adjust the grinding and polishing parameters so that you can get consistently high-precision results in a short amount of time.