Used ACCRETECH / TSK W-GM-4200 #293813026 for sale

ACCRETECH / TSK W-GM-4200 is a high-precision wafer grinding, lapping and polishing equipment designed to process semiconductor wafers. This advanced machine offers best-in-class performance that is consistent with the exacting demands of the semiconductor industry. The system consists of a host machine connected to a series of processing units and process tools. TSK WGM 4200 is based on an advanced mechanical platform, featuring high-grade cast alloy and stainless steel components for reliability and robustness. It is equipped with a CNC controller capable of handling both simple point-to-point and complex path motion control. It is also equipped with a precise spindle drive to perform a variety of grinding, lapping and polishing operations with highest precision. The advanced feed control is used to correct and optimize material removal and finish. Additionally, a load monitor helps to regulate and stabilize processing parameters during operation. The machine features an automatic wafer handling unit and a robotic module for efficient wafer handling. This allows for quick and reliable wafer loading and unloading. The machine is also equipped with outputs for dry and cryogenic polishing and enables the chemical mechanical polishing (CMP) of various wafer materials, including Si, Si-Ge and Cu. Furthermore, the tool is capable of single- and double-sided operations and can process wafers with up to 400 mm in diameter and a maximum configuration of 5.7 in. It also features a full suite of safety features and CCD inspection capability. ACCRETECH W-GM 4200 can deliver precise, repeatable results with a sub-micron level of accuracy. This asset is the perfect choice for wafer grinding, lapping, and polishing operations requiring superior performance. It is designed to meet the increasing demand for high-resolution, high-accuracy and high-volume semiconductor wafer processing.