Used ACCRETECH / TSK W-GM-4200 #9220489 for sale

ACCRETECH / TSK W-GM-4200 is a high precision wafer grinding, lapping and polishing equipment for semiconductor and advanced material industries. This system is designed to perform wafer grinding, lapping and polishing processes on a continuous basis with minimum downtime and maximum precision. TSK WGM 4200 is designed to accept multiple types of wafers with different steps such as face grinding, vertex grinding, back grinding, CMP, PCMP, Batch Grind and micro polishing. This unit is also capable of handling metal coated wafers as well as domestic and imported wafers. ACCRETECH W-GM 4200 is equipped with a sophisticated computer-programmed control machine for easy operation that provides real-time inspection and optimization. This tool offers an intelligent grinding mode that reduces the wait time for the desired surface finishes by continuously analyzing surface data and predicting disturbances that could disrupt the grinding process. It also features an auto-feed asset that automatically feeds the wafers into the lapping and polishing stages for enhanced process accuracy, as well as a rotating table that offers a one-step exchange of up to 10 different grinding / lapping plates. The model is composed of a main base with four grinding / lapping stations, a controller for each station, a back side grinding station and a rocking table. These grinding / lapping stations are designed to obtain a superior surface finish through multiple passes and different grinding / lapping abrasives. ACCRETECH W-GM-4200 is capable of processing 150~200 mm wafers up to 0.05 µm flatness or better, yielding excellent surface finishes. WGM 4200 also includes a hot plate equipment, a High Frequency Generator (HFCG) for improved signal stability, an Auto Profile Generator (APG) for precision surface measurements, and an Auto Focusing System (AFS) for automated grinding and lapping processes. The HFCG, APG and AFS are essential tools for inspecting the wafers for any anomalies in the grinding and lapping processes. In addition, this unit also includes a safety interlock machine that ensures safety for operators. Overall, ACCRETECH / TSK W-GM 4200 is an advanced tool for wafer grinding, lapping, and polishing. It offers high precision processes with minimum downtime, excellent surface finishes, and safe operation. This asset is an ideal choice for semiconductor and advanced material industries that require high precision, accurate processes.