Used ACCRETECH / TSK W-GM-4200B #9250481 for sale

ACCRETECH / TSK W-GM-4200B is a state-of-the-art wafer grinding, lapping & polishing equipment specifically designed to hone the highest quality surface finishes on semiconductor, solar, and other materials. TSK W-GM-4200B utilizes a unique combination of automated electrochemical slurry & slurry dispensing, scubbing, ultrasonic agitation, polishing, and buffing processes to quickly and precisely lap, grind, & polish wafer surfaces. This advanced system provides unsurpassed accuracy and accuracy control for superior surface finish results. Additionally, ACCRETECH W-GM-4200B allows for precise adjustment of polishing parameters to customize result. The unit is designed for both single- and multiple-wafer processing. W-GM-4200B is a fully automated, multi-function machine that offers a wide range of features to ensure process integrity and end-product quality. The automatic controls on the machine provide the ability to tailor and optimize process parameters according to process needs. This machine is equipped with an advanced touchscreen user interface, allowing for easy configuration and monitoring of processes. The tool also features an adjustable speed control asset to ensure consistent results across different wafer sizes. Additionally, ACCRETECH / TSK W-GM-4200B incorporates a process monitoring model to detect process aberrations and provide real-time process feedback for improved control. TSK W-GM-4200B is also designed with an integrated handling equipment to ensure the maximum flexibility for wafer size and thickness. This system is equipped with an integrated laser scanner for precise wafer edge detection and positioning control. The integrated handling unit also features a safety mechanisms for secure reloading of wafers, as well as an automated cleaning machine to prevent cross-contamination of surfaces. ACCRETECH W-GM-4200B also supports variety of options for data collection and analysis. An onboard data logger allows for comprehensive data tracking, process optimization, and product traceability. This tool is also outfitted with remote monitoring capabilities for long-term data collection and analysis. Additionally, W-GM-4200B integrates with pre- and post-process measurement systems to further verify process integrity and end-product quality. Overall, ACCRETECH / TSK W-GM-4200B is a powerful and user-friendly asset that provides the highest quality surface finishes on a wide range of materials. The model's advanced features ensure precision, accuracy, and repeatability for superior results. The equipment's integrated data acquisition and analysis features enable comprehensive process optimization and product traceability for added assurance. TSK W-GM-4200B is designed for complete flexibility, offering an unparalleled range of options and capabilities for wafer grinding, lapping, and polishing.