Used ACCRETECH / TSK W-GM-4250 #293827144 for sale

ACCRETECH / TSK W-GM-4250 is a technologically advanced wafer grinding, lapping and polishing equipment specifically designed for wafer processing in the semiconductor industry. This system can process precision semiconductor wafers up to 8 inches in diameter. Additionally, it can process LED wafers made from gallium nitride (GaN), as well as many other materials, such as silicon, gallium arsenide, aluminum nitride, and sapphire. TSK W-GM-4250 consists of a double-sided spindle with diamond-graded lapping discs, a pair of tapered-groove polishing plates, and a custom-built wafer actuation unit. The double-sided spindle is driven by two servo motors that enable precise control over the spindle's speed and direction of rotation. This allows the operator to adjust the speed of the spindle and its direction of rotation while working on each wafer to ensure that the grinding, lapping, and polishing processes are completed in precise stages. The pair of tapered-groove polishing plates is capable of maintaining an even surface finish throughout the entire wafer surface, while minimizing stress and strain on the wafer during the process. This design is based on a combination of "ridged" and "fluted" grooves, with each groove providing additional support and stability during polishing. These two plates are also programmed to move in opposite directions, ensuring that the polishing process is as efficient as possible. ACCRETECH WGM 4250 is also equipped with an intuitive, user-friendly control machine. This control tool allows the operator to select specific programs and settings for their wafer processing cycle. This user-friendly control asset includes an LCD touchscreen, allowing for easy navigation through the various menu options. Additionally, it automatically stores all previous wafer processing parameters, ensuring that the operator has quick access to any previously used settings for their next wafer grinding, lapping, or polishing cycle. ACCRETECH / TSK WGM 4250 is an essential tool for any wafer processing facility. This technologically advanced model is designed to produce high-precision results while minimizing the stress placed on wafers throughout the entire process. Its double-sided spindle, tapered-groove polishing plates, and user-friendly control equipment make it the go-to system for wafer grinding, lapping, and polishing needs.