Used ACCRETECH / TSK WGM 200C #9170541 for sale

ACCRETECH / TSK WGM 200C is a high-precision wafer grinding, lapping, and polishing equipment for high-volume production of semiconductor or other wafer-based devices. Featuring a rotating lap plate designed for high-precision polishing of wafer surfaces, the system is capable of precision grinding and polishing of diameters of up to 200 mm. With five-axis motion control, the unit is able to provide a homogenous, precise finish, even when moving along a complex trajectory. TSK WGM 200C is designed for efficient production in demanding industrial settings, with a unique, easy-to-use interface and automated optimization controls for precise operation. The machine sits atop an ergonomic, stationary platform, and features a robust collection of motors for precise and efficient control of the plate chuck, arm, and lap plate rotation. The linear and rotational axes are all individually monitored and calibrated for accuracy and uniformity. ACCRETECH WGM 200C is equipped with a durable and robust abrasive workhead which is designed to minimize wear and tear while maintaining a precise and repeatable finish. The workhead is designed to quickly and efficiently course and dress the wafer to the required lapping plate. The lapping plate is equipped with an automatic cleaning and grit-recovery tool, which removes debris and particles generated during each lapping cycle. WGM 200C is a powerful and productive wafer grinding, lapping, and polishing asset, designed to meet the needs of industrial production settings. The model is equipped with a variety of accessories such as force detection, grinding wheels, and specialized tools, allowing technicians to quickly complete projects with a consistent, high-precision finish. The equipment is able to consistently produce flat, uniform, highly polished wafers with sub-micron accuracy, making it the ideal solution for demanding and quality-focused applications.