Used ACCU FINISH Series II #9172412 for sale

ACCU FINISH Series II is a comprehensive wafer grinding, lapping and polishing equipment that is designed to deliver superior grinding, lapping and polishing results. Its unique design combines a high-precision, 5-axis gantry system with an advanced control unit for unparalleled results. The machine includes a built-in spindle for high-speed rotation and delivers the highest levels of particle reduction. The lapping process is controlled by precision feedback control algorithms, and the polishing process is controlled by a dedicated motor and a variable-speed frequency drive tool. The asset is designed to operate in ambient temperatures from 10°C to 60°C. It also has an integrated dust collection model and is equipped with an environmentally friendly, low-noise design that significantly reduces impact on the environment. Series II features multiple grinding and lapping capabilities, such as side grinding, back grinding, crosswinding, recess grinding, surface lapping, and edge lapping. Its grinders offer high-speed capabilities for fast material removal while offering precise control for surface finish, geometry and flatness. The built-in lapping process eliminates the need for external laps or conditioning diamond. The equipment is also capable of planarizing surfaces and machining back surfaces. ACCU FINISH Series II utilizes an easy-to-use, user-friendly software control system that is fully integrated with the control unit. This machine allows for precise parameter input, such as the cutting speed, grit size, grinding angle, and lapping power. This advanced tool also enables the user to track and monitor process data such as aspect ratio, roughness, and pitch values. Series II is an extremely reliable and powerful asset that delivers exceptional results. With its high-precision, 5-axis gantry model, advanced control equipment, and user-friendly software, this system is able to deliver top-quality grinding, lapping and polishing results in less time and with less effort.