Used ACCUPRO (Wafer Grinding, Lapping & Polishing) for sale

Accupro is a leading manufacturer of wafer grinding, lapping, and polishing equipment. Their systems are known for their high precision, efficiency, and reliability. Wafer grinding refers to the process of thinning wafers down to the desired thickness. Accupro's wafer grinding units use advanced grinding wheels and controlled pressure to achieve accurate and consistent results. These machines allow for precise control over material removal, resulting in wafer thickness uniformity and flatness. Lapping is a process used to achieve high surface finish on wafers. Accupro's lapping tools utilize a combination of rotational and reciprocating motion to remove material and smooth the surface of the wafer. These assets are designed to provide optimal flatness and parallelism. Polishing is the final step in wafer preparation, where the surface is further smoothed and a mirror-like finish is achieved. Accupro's polishing models employ advanced polishing pads and slurries to remove any remaining imperfections and create a polished surface with low surface roughness and high reflectivity. The advantages of Accupro's wafer grinding, lapping, and polishing equipment include precise control over thickness, excellent surface finish, high productivity, and ease of operation. With these systems, wafer manufacturers can ensure the quality and consistency of their products. An example of Accupro's wafer grinding system is the model 06534051. This system is designed for small and medium-sized wafers and offers high accuracy and productivity. It is equipped with advanced control features to ensure the desired thickness is achieved consistently. Overall, Accupro's wafer grinding, lapping, and polishing units are highly regarded in the industry for their efficiency, precision, and reliability, making them a trusted choice for wafer manufacturers worldwide.