Used ACCUPRO GOLD CE3R #9393220 for sale

ACCUPRO GOLD CE3R is a wafer grinding, lapping & polishing equipment designed to provide quick, accurate, and repeatable results. As a lapping and polishing system, it is capable of producing different levels of surface finishes on semiconductor wafers, which can be measured and monitored in real time. The unit is suitable for achieving fine surface finishes that are ideal for the production of the highest grade semiconductor chips. To achieve the desired results, the machine uses five different components that work together to fulfill specific tasks. These components include a grinder, lapper, polish, a conditioning wheel, and a servo drive. The grinder is used to reduce the size, shape, and surface roughness of the wafer to the desired specifications. It features three axes of motion: X, Y and Z. The grinder can be run in either manual or automatic modes and can also be used with a robot. The lapper is responsible for reducing the surface roughness of the surface. This is achieved by making small compressive strokes upon the wafer and applying additional pressure, when necessary. The lapper features two axes of motion: X and Y. The polisher is most commonly used to reduce the scratch and debris that is generated during the lapping process. It is capable of providing a variety of finishes, and allows for the use of different abrasive materials. The polisher also features two axes of motion: X and Y. The conditioning wheel is responsible for conditioning the abrasive materials during the process of grinding and lapping. This is achieved by spinning the wheel at high speeds and ensuring that all abrasives have a greater degree of uniformity. The servo drive is responsible for maintaining the accuracy of the grinding, lapping, and polishing process. This is achieved by continuously adjusting the speed and power of the device in order to provide maximum accuracy and repeatability. Overall, CE3R is an advanced wafer grinding, lapping & polishing tool suitable for the production of semiconductor wafers. It offers conveniently adjustable parameters and can be used with various types of abrasives in order to achieve the desired results. Using this asset, the desired surface topography can be achieved quickly and accurately.