Used ACER AGS 1020AH #9243022 for sale

ACER AGS 1020AH Wafer Grinding, Lapping & Polishing Equipment is a modern and versatile system engineered to meet the wide range of requirements in the semiconductor industry. The unit offers high-precision grinding, lapping and polishing of the most advanced wafers, including Silicon, Silicon-On-Insulator (SOI), Silicon/Germanium (SiGe), Gallium Arsenide (GaAs) and other Compound Semiconductor materials. It allows for single- or multi-axis work stage configurations and offers a unique combination of accuracy, flexibility and versatility. The machine's main components include a three-axis CNC machine tool, an X-Y-Z interpolation base, a spindle, a grinding wheel spindle, a polishing arm, an in-feed/ off-load tool, and a comprehensive console panel. The X-Y-Z interpolation base supports high-speed motion capabilities with smooth and accurate movements, while the grinding wheel spindle and polishing arm provide enhanced accuracy of roundness and flatness. The asset is powered by a reliable and efficient AC motor with a power rating of 2.8kw. AGS 1020AH Wafer Grinding, Lapping & Polishing Model features a precision variable-speed column which can be adjusted to the user's desired RPM with a range up to 6000rpm. This machine also includes a remote diagnostics equipment that allows users to monitor and debug the system remotely. Other key features include an integrated vacuum unit with cyclone technology, an advanced PC-based control machine, and a sealed water-cooled grinding wheel spindle for greater precision and temperature control. The tool offers top-notch grinding capabilities with a throughput rate of 350wafers/hour. ACER AGS 1020AH boasts advanced safety features including a chemical hood for dust collection & filtration, low-voltage circuit design for a safe work environment, as well as an insulation/overload protection asset. This advanced model also offers increased accuracy and surface quality with minimal burr or void while maintaining highest possible surface smoothness. In summary, AGS 1020AH Wafer Grinding, Lapping & Polishing Equipment offers a modern and versatile approach to advanced wafer grinding, lapping, and polishing. Featuring advanced safety features and superior performance, this system is ideal for semiconductor manufacturers who require precision and accuracy for their grinding, lapping, and polishing operations.