Used ADAL HB225C #9018501 for sale

ADAL HB225C is a wafer grinding, lapping and polishing equipment designed to provide an economical, automated, and reliable solution for precision grinding, lapping and polishing of wafers. It is ideal for applications in semiconductor, optical components, as well as in micro parts industries. HB225C includes two main components: a grinding/lapping/polishing system and an optional micro-abrasive blade. The grinding/lapping/polishing unit utilizes a unique combination of rotary and linear motions to achieve the desired grinding, lapping and polishing of wafers. The grinding/lapping/polishing process is achieved using a variable speed stepper motor which drives a belt and pulley machine. This tool allows for the direct transfer of force from the motor to the grinding media. The grinding media consists of diamond or cubic boron nitride (CBN) grinding wheels. The optional micro-abrasive blade is recommended for fine-pitch wafers or wafers with special requirements. The blade can be adjusted to accurately grind and polish very small, delicate features. It is ideal for creating smooth surface finishes and maintaining the consistency of the wafer profile. ADAL HB225C is equipped with a CCD line camera for wafer mapping and vision-guidance capabilities. It also supports a variety of sensors to monitor, control and analyze the grinding/lapping/polishing process. The user-friendly operating interface features a touch screen-based graphical user interface with automated settings, preset recipes, real-time monitoring, and trouble-shooting. It is available in either English or Chinese language. HB225C is built for high performance, reliability and ease of use. It is designed to meet the needs of demanding semiconductor and optical industries. This asset is capable of creating micro-smooth finishes, improving wafer performance, and reducing production costs.