Used ALLIED 70-1206 #165283 for sale

ALLIED 70-1206 Wafer Grinding, Lapping and Polishing Equipment is an easy-to-use, versatile and cost-effective solution for polishing both metal and plastic wafers to specifications. This system can be used for both single wafer processing and for batch runs. 70-1206 offers an efficient and consistent wafer grinding and polishing process, with 5 station turntable, 300 mm contact wheel, 2-stage water-cooled grinding/polishing heads and a variable-speed drive motor. This unit allows for quick, one-step processing of a wide range of materials, including polycrystalline diamond wafers and aluminum oxide and silicon nitride wafers. ALLIED 70-1206 is designed to provide maximum operator safety with safety interlocks, pressure-sensitive pads, and electrical and process controls. 70-1206 is equipped with a high-precision positioning machine which enables the precise and repeatable grinding/polishing of multiple wafers simultaneously. This user friendly tool features an LCD display which allows for easy navigation and control of the process parameters. The asset includes a pol for preparing wafers for pre-grinding and lapping, an external 8-inch lapping back-plate, and two additional water-cooled grinding/polishing heads for producing highly polished wafers with very tight tolerances. All components of ALLIED 70-1206 model are designed for unsurpassed performance and reliability, and a wide range of accessories are available to ensure optimum use of the equipment. 70-1206 Wafer Grinding, Lapping and Polishing System is the perfect tool for achieving precise, high-quality wafer polishing results. This unit offers fast and repeatable processing of a wide range of materials, and provides consistent, reliable results every time.